Fabrication and characterization of three-dimensional InGaAs/GaAs nanosprings.

This paper presents the use of a novel fabrication technique to produce three-dimensional (3D) nanostructures. The process is based on conventional microfabrication techniques to create a planar pattern in an InGaAs/GaAs bilayer that self-assembles into 3D structures during a wet etch release. The nanostructures are proposed to function as nanosprings for electromechanical sensors. Nanomanipulation inside a scanning electron microscope (SEM) was conducted to probe the structures for mechanical characterization. The results were validated by simulation.